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1. 3D Integration for VLSI Systems

   Edited by Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester

   Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they...

   Published September 25th 2011 by Pan Stanford Publishing